ʻO DY-256C Hōʻike Hōʻikeʻike Thermal
ʻO DY-256C kahi micro infrared thermal imaging module o ka hanauna hou loa, me ka liʻiliʻi liʻiliʻi ma muli o kāna hoʻolālā kaapuni hoʻohui kiʻekiʻe.
Hoʻohana ia i ka hoʻolālā split-type, ua hoʻopili ʻia ka lens a me ka papa interface e ke kaula palahalaha, me kahi mea ʻike wafer-grade vanadium oxide me ka haʻahaʻa haʻahaʻa.
Hoʻohui ʻia ka module me ka lens 3.2mm a me ka shutter, i hoʻolako ʻia me ka USB interface board, no laila hiki ke hoʻomohala ʻia i nā mea like ʻole.
Hāʻawi ʻia ka protocol control a i ʻole SDK no ka hoʻomohala kiʻekiʻe.
| Hōʻike huahana | Nā ʻāpana | Hōʻike huahana | Nā ʻāpana |
| ʻAno ʻike | ʻO ka Vanadium oxide i hoʻoluʻu ʻole ʻia i ka mokulele infrared | Olelo Hooholo | 256* 192 |
| Laulā hiʻona | 8-14um | Laina ana wela | -15 ℃-600 ℃ |
| ʻO ke kaawale ʻana o ka pixel | 12um | Pono ke ana ana wela | ± 2 ℃ a i ʻole ± 2% o ka heluhelu, ʻoi aku ka nui |
| NETD | ＜50mK @25℃ | Voltage | 5V |
| ʻO ke alapine paʻa | 25Hz | Nā ʻāpana leki | 3.2mm F/1.1 |
| Hoʻoponopono hakahaka | Kākoʻo | Kūlana hoʻonohonoho | Paʻa ka manaʻo |
| Hana wela | -10 ℃-75 ℃ | Ka nui o ka papa waena | 23.5mm*x15.)mm |
| Kaumaha | <10g | Hoʻoponopono ʻana i ka mahana | Hāʻawi ʻia ka calibration lua |
| Ikepili | USB |
E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou
