Hoʻokumu ʻia ka module imaging thermal ma luna o ka ceramic packaging uncooled vanadium oxide infrared detector e hoʻomohala i kahi hana kiʻekiʻe infrared thermal imaging huahana, nā huahana e hoʻohana i ka pānaehana puka kikohoʻe like ʻole, waiwai nui ka interface, hiki ke hoʻololi i kahi ʻano o ka papa hana naʻauao, me ka hana kiʻekiʻe a me ka mana haʻahaʻa. ka hoʻohana ʻana, ka leo liʻiliʻi, maʻalahi i nā ʻano o ka hoʻohui hoʻomohala ʻana, hiki ke hoʻokō i ka noi ʻana o nā ʻano like ʻole o ke ana wela infrared o ke koi hoʻomohala lua.

I kēia manawa, ʻo ka ʻoihana mana ka ʻoihana hoʻohana nui ʻia o nā lako kiʻi kiʻi kiʻi infrared. ʻO ke ʻano ʻoi loa ka maikaʻi a me ke ʻano o ka ʻike pili ʻole, hiki i ka infrared thermal imager ke hoʻomaikaʻi nui i ka holomua o ka loaʻa ʻana o ka mahana a i ʻole ka nui kino, a hoʻomaikaʻi hou i ka hana hilinaʻi o nā lako lako mana. He mea koʻikoʻi loa nā mea hana kiʻi wela infrared i ka ʻimi ʻana i ke kaʻina hana o ka naʻauao a me ka super automation i ka ʻoihana mana.

ʻO ka nui o ka nānā ʻana i nā hemahema o nā ʻāpana kaʻa he ʻano hoʻāʻo nondestructive no ka uhi ʻana i nā kemika. No laila, pono e wehe ʻia nā kemika i uhi ʻia ma hope o ka nānā ʻana. No laila, mai ka hiʻohiʻona o ka hoʻomaikaʻi ʻana i ke kaiapuni hana a me ke olakino o nā mea hoʻokele, pono ia e hoʻohana i nā ʻano hoʻokolohua non-destructive me ka ʻole o nā kemika.

Ma lalo iho nei kahi hoʻolauna pōkole o kekahi mau ʻano hoʻāʻo nondestructive manuahi. ʻO kēia mau ʻano hana e hoʻopili i ka māmā, wela, ultrasonic, eddy current, current and other excitation waho i ka mea nānā e hoʻololi i ka mahana o ka mea, a me ka hoʻohana ʻana i ka infrared thermal imager e hana i ka nānā ʻole ʻana i nā hemahema o loko, nā māwae, peeling kūloko o ka mea, a me ka welding, hoʻopaʻa, mosaic hemahema, density inhomogeneity a me ka uhi kiʻi mānoanoa.

Infrared thermal imager nondestructive ho'āʻo 'enehana i ka pono o ka wikiwiki, non-destructive, non-contact, maoli-manawa, nui wahi, mamao 'ike a me ka 'ike. He mea maʻalahi i ka poʻe hoʻomaʻamaʻa ke aʻo koke i ke ʻano hoʻohana. Ua hoʻohana nui ʻia i ka hana mechanical, metallurgy, aerospace, medical, petrochemical, electric power and other fields. Me ka hoʻomohala ʻana o ka ʻenehana kamepiula, ua lilo ka ʻōnaehana naʻauao a me ka ʻike ʻana o ka infrared thermal imager i hui pū ʻia me ka lolouila i ʻōnaehana ʻike maʻamau e pono ai i ka nui o nā kula.

ʻO ka hoʻāʻo nondestructive he kumuhana ʻenehana hoʻohana ʻia e pili ana i ka ʻepekema a me ka ʻenehana hou. Hoʻokumu ʻia ia ma ke kumu o ka luku ʻole ʻana i nā ʻano kino a me ke ʻano o ka mea e hoʻāʻo ʻia. Hoʻohana ʻo ia i nā ʻano hana kino e ʻike inā he mau hemahema (nā hemahema) i loko a i ʻole ka ʻili o ka mea, i mea e hoʻoholo ai inā kūpono ka mea e hoʻāʻo ʻia, a laila loiloi i kona hiki ke hana. I kēia manawa, hoʻokumu ʻia ka mea kiʻi kiʻi wela infrared ma ka hoʻopili ʻole, wikiwiki, a hiki ke ana i ka mahana o ka neʻe ʻana i nā pahu hopu a me nā pahu micro. Hiki iā ia ke hōʻike pololei i ke kahua wela o ka ʻili o nā mea me ka hoʻonā wela kiʻekiʻe (a hiki i 0.01 ℃). Hiki iā ia ke hoʻohana i nā ʻano ʻano hōʻike like ʻole, mālama ʻikepili a me ka hana naʻauao kamepiula. Hoʻohana nui ʻia ia i ka aerospace, metallurgy, machinery, petrochemical, machinery, architecture, natural forest protection and other fields Domain.