ʻO ka mea hana alakaʻi a me ka mea hoʻolako 256 × 192 Thermal Imaging Camera Module cores

E hāʻawi mākou iā mākou iho i ka hāʻawi ʻana i kā mākou mea kūʻai mahalo me nā lawelawe loea noʻonoʻo noʻonoʻo no ka mea hana alakaʻi a me ka mea hoʻolako 256 × 192Kamehana Kiʻi ThermalModule cores, I kēia manawa ua hoʻokumu mākou i nā hui ʻoihana paʻa a lōʻihi me nā mea kūʻai mai ʻAmelika ʻAmelika, ʻEulopa Komohana, ʻApelika, ʻAmelika Hema, ʻoi aku ma mua o 60 mau ʻāina a me nā ʻāina.
E hāʻawi mākou iā mākou iho i ka hāʻawi ʻana i kā mākou mea kūʻai mahalo me nā lawelawe loea noʻonoʻo noʻonoʻo loaAna wela, mea ʻike kamepiula wela, pahu pahu pahu wela, Kamehana Kiʻi Thermal, Hāʻawi mākou i ka maikaʻi maikaʻi akā unbeatable kumu kūʻai haʻahaʻa a me ka lawelawe maikaʻi loa. Welina mai e kau i kāu mau laʻana a me ke apo kala iā mākou .E hana mākou i nā waiwai e like me kāu noi. Inā makemake ʻoe i nā huahana a mākou e hāʻawi nei, e ʻoluʻolu e hoʻokaʻaʻike mai iā mākou ma ka leka uila, fax, kelepona a i ʻole pūnaewele. Aia mākou ma ʻaneʻi e pane i kāu mau nīnau mai ka Pōʻakahi a hiki i ka Pōʻaono a ke kakali nei mākou e launa pū me ʻoe.

♦ Nānā

ʻO ka M10-256 integrated infrared thermal imaging core kahi huahana kiʻi infrared thermal imaging kiʻekiʻe i kūkulu ʻia ma ke kumu o kahi wafer-grade encapsulated uncooled vanadium oxide infrared detector. Hoʻohana ʻia ka puka ʻana o ka USB interface no ka huahana, kahi e hoʻokiʻekiʻe ai i nā kikowaena mana he nui a hiki ke hoʻololi ʻia i nā ʻano hana hoʻoponopono naʻauao. Me kāna hana kiʻekiʻe, haʻahaʻa mana hoʻohana, liʻiliʻi liʻiliʻi, a me kahi hiʻohiʻona o ka hoʻomohala maʻalahi a me ka hoʻohui ʻana, ua kūpono ka huahana no nā pono hoʻomohala lua o nā huahana ana i ka wela infrared.

♦kikoʻī

ʻO M10-256 kahi micro infrared thermal imaging camera module o ka hanauna hou loa, me ka liʻiliʻi liʻiliʻi ma muli o kāna hoʻolālā kaapuni hoʻohui kiʻekiʻe. Hoʻohana ka module i ka hoʻolālā split-type, ua hoʻopili ʻia ka lens a me ka papa interface e ke kaula paʻa, me kahi mea ʻike wafer-grade vanadium oxide me ka haʻahaʻa haʻahaʻa. Hoʻohui ʻia ka module me ka lens 3.2mm a me ka shutter, i hoʻolako ʻia me ka USB interface board, no laila hiki ke hoʻomohala ʻia i nā mea like ʻole. Hāʻawi ʻia ka protocol control a i ʻole SDK no ka hoʻomohala kiʻekiʻe.

ʻO ka liʻiliʻi liʻiliʻi, me ka lens mua o (13 * 13 * 8) mm wale nō a me ka papa kuhikuhi o (23.5 * 15.3) mm.
ʻO ka hoʻohana haʻahaʻa haʻahaʻa a hiki i 640mW;
Hāʻawi kahi hoʻonā o 256 * 192 i ke kiʻi wela kiʻekiʻe;
Hoʻolako ʻia me ka USB interface papa, hiki ke hoʻomohala ʻia i nā huahana like ʻole;
Hoʻohana ʻia ka hoʻolālā Split-type no ka lens a me ka papa interface, i hoʻopili ʻia e ka FPC flat cable;