DyMN Series Thermal Imaging Core
Hoʻohana ka DyMN-640/384 series uncooled thermal imaging core i ka patented "Falcon" infrared thermal processing chip e hoʻololi i ka hoʻonā FPGA kuʻuna, a nona kahi mea ʻike 12μm pixel WLP i hoʻomohala hou ʻia, e hāʻawi ana i kahi kikowaena kikohoʻe like no ka hoʻohui ʻana a ka hoʻomohala ʻana, a hiki ke hoʻopili pono ʻia i nā ʻano hana hana akamai. Me ka hana kiʻekiʻe, ka liʻiliʻi liʻiliʻi, ke kaumaha māmā, ka hoʻohana haʻahaʻa haʻahaʻa a me ke kumukūʻai waiwai, e hālāwai ana i nā koi noi o SWaP3 (Size, Weight and Power, Performance, Price).
DyMN-640 | DyMN-384 | |
ʻAno ʻike | Vox ʻAʻole | |
Laulā hiʻona | 8~ 14 μm | |
Hoʻoholo IR | 640×512 | 384×288 |
Pikika | 12μm | |
NETD | ≤50mK@25℃,F#1.0 (≤40mK koho) | |
FOV | 48.7°×38.6° | 29.2°×21.7° |
Lens | 9.1mm F1.0 | |
Ka helu hōʻano hou | kiʻi:50Hz/25Hz; wela:25Hz; | |
Hoʻoponopono kiʻi | ʻAʻole TEC algorithm Hoʻoponopono ʻole like ʻole Hoʻemi ka leo kānana kikohoʻe Hoʻonui kikoʻī kikohoʻe | |
Hoʻopuka kiʻi | 10 bit/14 bit (hiki ke hoʻololi) | |
Hoʻopili | Hoʻoponopono a manual paha | |
Laulā ana | (-20℃~+150℃ ,0℃~+450℃ ) | |
Ka pololei ana ana | ± 2 ℃ a i ʻole ± 2% | |
ʻAno ana | Lae, laina, pahu | |
Lako ikehu | 1.8V, 3.3V, 5V*2 | |
Kaʻai@25℃ | <0.65W | <0.6W |
Kiʻi kiʻi | SPI/DVP | |
Manaʻo hoʻomalu | I2C | |
Anana | 21mm×21mm | |
Kaumaha | 9 g | |
Hana wela | (-40 ℃~+80 ℃ | |
Ka mahana mālama | (-50 ℃~85 ℃ | |
Haʻalulu | 80g@4ms |
E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou